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Backlight LED device
背光LED器件
-
01.JB.CC4014W75P00
适用于所有的SMT组装和焊接工艺
封装尺寸:4.0*1.45*0.7mm
超薄
防潮等级Level3
适用于所有的SMT组装和焊接工艺
包装每卷4000PCS